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Hexafluoro-1,3-butadiene

Hexafluoro-1,3-butadiene is a liquefied gas, toxic, flammable, N.O.S. It is is an environmentally friendly dry etching gas with low GWP, high etching rate, high selectivity and high aspect ratio, showing very high performance for critical plasma etching in semiconductor devices manufacturing.

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Hexafluoro-1,3-butadiene

Formula: C4F6

Hexafluoro-1,3-butadiene is used in semiconductor materials processing as a dry etching gas for deep reactive ion etching (DRIE) of silicon-based materials.  As an etchant, it provides high etching rates with good selectivity, and thus provides features with high aspect ratio (HAR).  Owing to the reactivity of its olefinic bonds, it has low global warming potential (low-GWP) and is considered an environmentally friendly etchant.

Applications

Specifications

Further Specifications

Cylinder Sizes

  • Used for critical plasma etching in semiconductor devices manufacturing.
Grade 3 Grade 4
Purity 99.9% 99.99%
Nitrogen < 200 ppmv < 40 ppmv
Oxygen, Argon < 100 ppmv < 10 ppmv
Carbon Dioxide < 100 ppmv < 20 ppmv
Moisture < 20 ppmv < 20 ppmv
Other Fluorocarbons < 800 ppmv < 200 ppmv
Isopropylalcohol < 50 ppmv < 20 ppmv
Other Hydrocarbons < 500 ppmv < 250 ppmv
Hydrogen Fluoride < 50 ppmv <10 ppmv
Chemical & Physical Properties
Molecular Weight 162.034
Pressure @ 70°F 25 psig
Valve Outlet CGA 350 DISS 724
Shipping Information
DOT Name 1,3 Hexafluorobutadiene
Hazard Class 2.3, 2.1
DOT No. UN 3160
DOT Label Toxic, Flammable, Inhalation Hazard Zone B
CAS No. 685-63-2
Cylinder Size Fill Weight
44L/Size 200 99
44L/Size 200 55
16L/Size 80 30
7L/Size 35 12

**Moisture level guaranteed only when Electronic Fluorocarbons prepares the cylinders.
All concentrations are on a mol/mol basis unless otherwise stated.
Product sold on the basis of total impurities. Individual impurities may vary slightly.

*This gas not available for purchase online.