Hexafluoro-1,3-butadiene is used in the manufacture of semiconductors as a chemical solvent, corrosive gas or in a plasma to remove unwanted parts of a wafer or surface layer. It is an environmentally friendly, high performance, dry etching gas, used in plasma, ion beam or sputter etching, with low GWP, global warming potential, high selectivity, high etching rate, and high aspect ratio.
Octafluorocyclobutane is used in a number of diverse applications. It is used as a raw material to produce high performance fluoropolymers, such as ETFE, poly(ethene-co-tetrafluoroethene), and FEP, fluorinated ethylene propylene copolymer. Octafluorocyclobutane is used for food packaging and as a propellant for some foods.
- Used for critical plasma etching in semiconductor devices manufacturing.
|Grade 3||Grade 4|
|Nitrogen||< 200 ppmv||< 40 ppmv|
|Oxygen, Argon||< 100 ppmv||< 10 ppmv|
|Carbon Dioxide||< 100 ppmv||< 20 ppmv|
|Moisture||< 20 ppmv||< 20 ppmv|
|Other Fluorocarbons||< 800 ppmv||< 200 ppmv|
|Isopropylalcohol||< 50 ppmv||< 20 ppmv|
|Other Hydrocarbons||< 500 ppmv||< 250 ppmv|
|Hydrogen Fluoride||< 50 ppmv||<10 ppmv|
|Chemical & Physical Properties|
|Pressure @ 70°F||25 psig|
|Valve Outlet||CGA 350 DISS 724|
|DOT Name||1,3 Hexafluorobutadiene|
|Hazard Class||2.3, 2.1|
|DOT No.||UN 3160|
|DOT Label||Toxic, Flammable, Inhalation Hazard Zone B|
|Cylinder Size||Fill Weight|
**Moisture level guaranteed only when Electronic Fluorocarbons prepares the cylinders.
All concentrations are on a mol/mol basis unless otherwise stated.
Product sold on the basis of total impurities. Individual impurities may vary slightly.
*This gas not available for purchase online.