What is Hexafluoro-1,3-butadiene?
Hexafluoro-1,3-butadiene is an environmentally friendly dry etching gas with low GWP, high etching rate, high selectivity, and high aspect ratio.
Hexafluorobutadiene (C4F6) is a fluorinated hydrocarbon compound that has a number of applications in the semiconductor industry, particularly in the area of etching. Here are some of the key applications of hexafluorobutadiene in semiconductor etching:
Reactive ion etching (RIE): Hexafluorobutadiene is often used as a feed gas in RIE, which is a dry etching process that uses plasma to remove material from a substrate. The high reactivity and low toxicity of C4F6 make it an ideal candidate for this process.
Deep reactive ion etching (DRIE): In DRIE, C4F6 is used as a passivation gas to protect the sidewalls of the etched features from being etched further. This helps to create high-aspect ratio structures with precise dimensions.
Plasma-enhanced chemical vapor deposition (PECVD): C4F6 can be used as a precursor in PECVD, which is a process that deposits thin films of material onto a substrate using plasma. The use of C4F6 in PECVD can result in the deposition of high-quality fluorinated films with good conformality.
Chamber cleaning: C4F6 can also be used to clean the chambers of etching equipment. Its high reactivity and low toxicity make it an effective and safe cleaning agent.
Overall, hexafluorobutadiene is a versatile compound that has a number of important applications in the semiconductor industry, particularly in the area of etching. Its unique properties make it an important component in many etching processes, helping to create high-quality structures and devices.
**Moisture level guaranteed only when Electronic Fluorocarbons prepares the cylinders.
All concentrations are on a mol/mol basis unless otherwise stated.
Product sold on the basis of total impurities. Individual impurities may vary slightly.
*This gas not available for purchase online.